2021.09.14

Analysis of the technical level and characteristics of the semiconductor discrete device industry

The technology of semiconductor discrete devices involves many disciplines and fields such as microelectronics, semiconductor physics, materials science, electronic circuits, etc. The combination of different disciplines and domain knowledge promotes the continuous development of new technologies at the edge of the industry.

2021.09.14

Intel surpasses Samsung to become the world's semiconductor leader

Last year, the global semiconductor output value fell to 419.1 billion U.S. dollars, a year-on-year decrease of 12%. Intel's market share reached 16.2%, surpassing Samsung's 12.5%, and regained its position as the world's semiconductor leader.

2021.09.14

MOS tube switch tube loss calculation method formula detailed explanation

The maximum switching frequency that a power MOSFET can achieve depends on the switching loss. The energy loss of each pulse period can be estimated just like other devices. It can be calculated by integrating the product of V(t) and i(t) during the turn-on and turn-off process. During the opening period, it can be estimated as

2021.09.13

Five elements to realize advanced wafer-level packaging technology

The method of tracing the history of chip packaging and cutting a single unit from the entire wafer before subsequent packaging and testing has always been the "prescribed paradigm" for semiconductor chip manufacturing.

2021.09.13

Introduction to the structure and function of discrete devices

Discrete devices refer to electronic devices that have separate functions and cannot be separated. They can be divided into semiconductor diodes, triodes, bridge rectifiers, optoelectronic devices, etc.

2021.09.10

What is wafer testing? How to perform wafer test?

Wafer testing is to test each die on the wafer, attach a probe made of gold wire to the inspection head to make a probe (probe) as thin as a hair, and contact the pad on the die to test its electrical Characteristics

2021.09.10

Key Points of the Design and Layout of Semiconductor Wafer Shop

During the production process of semiconductor device wafers, it is easy to be affected by foreign objects, dust particles, metal ions and other foreign objects to destroy the surface structure.

2021.09.09

Introduction to MOSFET production process

From the beginning of production to the completion of the manufacturing of semiconductor products, there are mainly two processing processes, which are called front-end production and back-end production.