Today's consumers are looking for powerful multifunctional electronic devices that not only provide unprecedented performance and speed, but also have a small size and low cost. This has brought complex technology and manufacturing challenges to semiconductor manufacturers, who are trying to find new ways to provide better performance and functionality in small, low-cost devices.

　　FZWELEC Micro is an industry leader in providing a full range of wafer-level technology solution platforms. The solutions provided include fan-in wafer-level packaging (FIWLP), fan-out wafer-level packaging (FOWLP), and Silicon Communication Hole (TSV), Encapsulated Chip Package (ECP).

　　Solution

　　Wafer level chip size package