The bonding wires form the interconnection between the chip and the substrate, the substrate and the substrate, and the substrate and the package. Wire bonding is generally regarded as the most cost-effective and flexible interconnect technology and is currently used to assemble most semiconductor packages.

　　FZWELEC can use gold wire, silver wire, copper wire and other metals for wire bonding packaging. As a low-cost alternative to gold wire, copper wire is becoming the preferred interconnect material in wire bond packaging. Copper wires have similar electrical characteristics and performance to gold wires, and have lower resistance, which will be a big advantage when lower wire bonding resistance is required to improve device performance. Fairchild Micro can provide various types of wire bonding package, and save material cost to the greatest extent, so as to realize the most cost-effective copper bonding wire solution.

　　Solution

　　TO, DIP, SOT, SOP, TSOP

　　DFN