In flip-chip packaging, the silicon chip is directly fixed on the substrate using solder bumps instead of wire bonds, providing dense interconnections and high electrical and thermal performance. Flip-chip interconnection achieves the ultimate miniaturization, reduces package parasitics, and realizes a new mode of chip power distribution and ground distribution that cannot be achieved by other traditional packaging methods
FZWELEC offers a rich portfolio of flip-chip products, ranging from large single-chip packages with passive components to modules and complex advanced 3D packages, including a variety of different low-cost innovative options.
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