The current market demand for portable mobile data access devices is growing rapidly, and the requirements for functional integration and packaging complexity are also increasing. In order to meet the market's requirements for higher integration, better electrical performance, lower latency, and shorter vertical interconnections, packaging technology is forcing a shift from 2D packaging to more advanced 2.5D and 3D packaging designs. In order to meet these demands, various types of stacked integration technologies are used to integrate multiple chips with different functions into smaller and smaller sizes.

　　FZWELEC Micro actively promotes breakthroughs in traditional packaging technology, taking the lead in adopting a variety of innovative integration technologies in wafer-level packaging, flip-chip interconnection, through silicon via (TSV) and other fields to develop differentiated solutions to help customers Success in the market it serves.

Solution

　　QFPSD

　　2.5D / multi-chip eWLB